MediaTek Dimensity 8100, 8000, and 1300 announced | Dimensity 8000 | Dimensity 1300 | Dimensity 8100, 8000 and 1300 announced by MediaTek and debut with smartphones in March 2022
MediaTek has announced its high-end rivals, the Dimensity 8000 and Dimensity 8100, to compete with Qualcomm in the flagship sector. Both chips are 5 nm and have the same hardware. The 8100, on the other hand, is a silicon professional gambler, and it runs at faster speeds. The Dimensity 1300 is a minor enhancement over the 1200 chip.
The two 8000 chips have four large Cortex-A78 CPU cores and four little Cortex-A55 CPU cores. The GPU is a Mali-G610 MC6 from ARM, which employs the company’s most recent GPU architecture. The Dimensity 8100, compared to the 8000, will have a 20% higher GPU frequency. In GFXBench Manhattan (offscreen), the 8100 achieved 170 frames per second, whereas the 8000 only managed 140.
The MiraVision 780 is present in both processors, and it supports a 168 Hz refresh rate at FHD+ resolution. The 8100 chip also supports 120Hz at WQHD+, which is a notable distinction. Both include 4K AV1 video decoders and HDR10+ Adaptive compatibility (which adapts HDR10+ material to ambient light conditions).
The Imagiq 780 ISP can record HDR footage from two cameras at the same time at 5 gigapixels per second, as well as 4K 60 fps HDR10+ from one camera. This ISP supports cameras with up to 200 MP sensors, 2x lossless zoom, AI-powered noise reduction, and HDR imagery out of the box.
Both chipsets have 3GPP Release 16 5G modems with two carrier aggregations for up to 200 MHz of throughput. This enables download rates of up to 4.7 Gbps. 5G+5G Dual SIM, Dual Standby mode is supported by the modem.
Wi-Fi 6E (2×2), Bluetooth 5.3, and Bluetooth LE Audio with Dual-Link True Wireless Stereo Audio are all supported natively. Support for BeiDou’s new B1C frequency is included in the positioning.
|Specs||Dimensity 1200||Dimensity 8000||Dimensity 8100||Dimensity 9000|
|Node||6 nm||5 nm||5 nm||4 nm|
|CPU (big)||1x Cortex-A78 @ 3.0 GHz||–||–||1x Cortex-X2 @ 3.05 GHz|
|CPU (medium)||3x Cortex-A78 @ 2.6 GHz||4x Cortex-A78 @ 2.75 GHz||4x Cortex-A78 @ 2.85 GHz||3x Cortex-A710 @ 2.85 GHz|
|CPU (small)||4x Cortex-A55 @ 2.0 GHz||4x Cortex-A55 @ 2.0 GHz||4x Cortex-A55 @ 2.0 GHz||4x Cortex-A510 @ 1.8 GHz|
|RAM||LPDDR4X (up to 4,266 Mbps)||LPDDR5 (up to 6,400 Mbps)||LPDDR5 (up to 6,400 Mbps)||LPDDR5X (up to 7,500 Mbps)|
|Storage||UFS 3.1||UFS 3.1||UFS 3.1||UFS 3.1|
|GPU||Mali-G77 MC9||Mali-G610 MC6||Mali-G610 MC6 (20% faster than 8000)||Mali-G710 MC10|
|Display||FHD+ @ 168 Hz||FHD+ @ 168 Hz||FHD+ @ 168 Hz, WQHD+ @ 120 Hz||FHD+ @ 180 Hz, WQHD+ @ 144 Hz|
|Camera (stills)||200 MP||200 MP (5 Gpixel/s IPS)||200 MP (5 Gpixel/s IPS)||320 MP (9 Gpixel/s IPS)|
|Camera (video)||4K @ 60 fps||4K @ 60 fps (HDR10+), dual recording||4K @ 60 fps (HDR10+), dual recording||4K @ 60 fps (HDR10+), triple recording|
|5G||4.7 Gbps downlink, 2.5 Gbps uplink||4.7 Gbps downlink||4.7 Gbps downlink||7 Gbps downlink, 2.5 Gbps uplink|
|Wi-Fi||Wi-Fi 6 (2×2)||Wi-Fi 6E (2×2)||Wi-Fi 6E (2×2)||Wi-Fi 6E (2×2)|
The Dimensity 1300 is virtually identical to Dimensity 1200, with the exception of increased NPU performance for night mode and HDR processing with AI.
In the first quarter of 2022, smartphones with a Dimensity 1300, 8000, or 8100 chipsets will be available, so expect a flurry of announcements from “some of the world’s greatest smartphone manufacturers” in March.
The first phones with the Dimensity 8000 series are expected to arrive in “the next couple of weeks,” according to Mediatek, who also predicts a larger worldwide adoption than the Dimensity 9000.
While Mediatek isn’t in charge of device pricing, vice president and general manager of marketing Finbarr Moynihan told media that the Dimensity 8000 series phones should cost between $400 and $700.
The business also stated that the first mmWave chipset for the US market will be announced in H1 2022, as well as the first mmWave mid-range phone in H2 2022.