Mediatek Helio G96 vs Dimensity 700
We’ve compiled a full comparison of Mediatek’s recently introduced Helio G96 vs Dimensity 700 SoCs. We’ve now examined the advantages and disadvantages of these two 8-core CPUs, as well as their Geekbench, Antutu, and technical specifications.
CPU Performance
Gaming Performance
Battery Life
Tenzys Tech Score
Major differences between Helio G96 vs Dimensity 700
Pros of Mediatek Dimensity 700
- Dimensity 700 has a 7.31% higher CPU clock speed than Helio G96 (2200 vs 2050 MHz).
- Dimensity 700 has a smaller-sized transistor (7 nm versus 12 nm).
- Dimensity 700 shows 1.49% better AnTuTu 9 score (339 vs 334K).
- Dimensity 700 has 11.76% higher GPU Frequency (950 vs 850 MHz).
- Have 5G connectivity.
Full comparison between Helio G96 vs Dimensity 700
| SoC: | Helio G96 | Dimensity 700 |
Antutu 9
Total Score:
| CPU | 98570 | 98632 |
| GPU | 76840 | 71777 |
| Memory | 70017 | 72555 |
| UX | 94023 | 93594 |
Also Checkout: Dimensity 1200 vs Snapdragon 870
GeekBench 5
Single-Core Score
Multi-Core Score
| Image compression | – | 101.85 Mpixels/s |
| Face detection | – | 15 images/s |
| Speech recognition | – | 32.9 words/s |
| Machine learning | – | 27.9 images/s |
| Camera shooting | – | 14.55 images/s |
| HTML 5 | – | 2.1 Mnodes/s |
| SQLite | – | 543.4 Krows/s |
3DMark
3DMark Wild Life Performance
| Stability | 99% | 99% |
| Graphics test | 6 FPS | 6 FPS |
| Score | 1086 | 1097 |
Also Read: Snapdragon 8 gen 1 vs Snapdragon 780g
Gaming
| Games | FPS(Frames Per Second) | FPS(Frames Per Second) |
| PUBG Mobile | – | 51 |
| Call of Duty: Mobile | – | 37 |
| Fortnite | – | 25 |
| Shadowgun Legends | – | 59 |
| World of Tanks Blitz | – | 52 |
| Genshin Impact | – | 34 |
| Mobile Legends: Bang Bang | – | 56 |
Display
| Max On-Device Display | FHD+ @ 120Hz | FHD+ @ 90Hz |
| Max On-Display Resolution | 2520 x 1080 | 2520 x 1080 |
| Max External Display | – | QHD @ 60Hz |
| HDR | HDR10 | HDR10 |
| Color Depth | Up to 10-bit | Up to 10-bit |
| Color Gamut | Rec2020 | Rec2020 |
CPU
| Architecture | 2x 2.05 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 | 2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
| Cores | 8 | 8 |
| Base Frequency | 2000 MHz | 2000 MHz |
| Turbo Frequency | 2050 MHz | 2200 MHz |
| Instruction set | ARMv8.2-A | ARMv8.2-A |
| L1 cache | – | – |
| L2 cache | – | – |
| L3 cache | – | – |
| Process | 12 nanometers | 7 nanometers |
| TDP | – | 10 Watt |
| Transistor Count | – | – |
Graphics
| GPU name | Mali G57 MC2 | Mali-G57 MC2 |
| Architecture | Valhall | Valhall |
| GPU frequency | 850 MHz | 950 MHz |
| Execution units | 2 | 2 |
| Shading units | 32 | 32 |
| FLOPS | – | 243 Gigaflops |
| Vulkan version | 1.1 | 1.1 |
| OpenCL version | 2.0 | 2.0 |
| DirectX version | 12 | 12 |
Memory
| Memory type | LPDDR4X | LPDDR4X |
| Memory frequency | 2133 MHz | 2133 MHz |
| Bus | 2x 16 Bit | 2x 16 Bit |
| Max bandwidth | – | 17.07 Gbit/s |
| Max size | 10 GB | 12 GB |
Multimedia (ISP)
| Neural processor (NPU) | Yes | Yes |
| Storage type | eMMC 5.1, UFS 2.1 | UFS 2.2 |
| Max display resolution | 2520 x 1080 | 2520 x 1080 |
| Max camera resolution | 1x 108MP, 2x 16MP | 1x 64MP, 2x 16MP |
| Video capture | 4K at 30FPS | 2K at 30FPS |
| Video playback | 4K at 30FPS | 2K at 30FPS |
| Video codecs | H.264, H.265, VP9 | H.264, H.265, VP9 |
| Audio codecs | AAC, AIFF, CAF, MP3, MP4, WAV | AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC |
Also Read: Snapdragon 8 Gen 1 vs Dimensity 9000
Connectivity
| Modem | – | – |
| 4G support | LTE Cat. 13 | LTE Cat. 18 |
| 5G support | No | Yes |
| Peak Download speed | 600 Mbps (4G) | 2770 Mbps (5G), 1200 Mbps (4G) |
| Peak Upload speed | 150 Mbps (4G) | 500 Mbps (5G), 211 Mbps (4G) |
| Wi-Fi | 5 | 5 |
| Bluetooth | 5.2 | 5.1 |
| Navigation | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC |
Info
| Announced | June 2021 | November 2020 |
| Class | Mid-range | Mid-range |
| Model number | MT6781 | MT6833V/ZA |
| Official page | MediaTek Helio G96 official site | MediaTek Dimensity 700 official site |
Review by Tenzys Tech
CPU
The Mediatek Helio g96’s CPU is clocked at 2.05 GHz, whereas the Mediatek Dimensity 700’s CPU is clocked at 2.2 GHz, and both SoCs contain the same Cortex A76 cores. Because of improved overclocking, the Dimensity 700 provides a greater performance boost and is thus a superior option to the Helio g96.
GPU
Based on the specifications of both the Chipsets have Mali G57 MC2. So, there is no huge difference between the graphical units but based on the clock speed we can conclude that Helio g96 has a lesser clock speed of 850 MHz as compared to Dimensity 700 which has a GPU with an enhanced clock speed of 950 MHz. This concludes that Dimensity 700 is better as compared to Helio g96.
Energy efficiency and battery life
According to the technical specs of both SoCs, the Helio g96 is based on 12nm process technology, whereas the Dimensity 700 is built on 7nm technology. As a result, Dimensity 700 outperforms Helio g96 because the smaller size semiconductor signifies a greater number of transistors contained in SOC (System On Chip), which not only saves energy but also greatly improves the chipset’s performance.
Mediatek Helio G96
Summary
Designed for mid-range series of 4g smartphones.
Mediatek Dimensity 700
Summary
Based on 7nm lithography and designed for 5G mid-range smartphones.
Frequently Asked Questions
-
Which nm processor is G96?
The MediaTek Helio G96 is an 8-core chipset with a 12-nanometer manufacturing technology that was introduced on June 16, 2021. It features two Cortex-A76 cores running at 2050 MHz and six Cortex-A55 cores running at 2000 MHz.
-
What is MediaTek Helio G96?
The MediaTek Helio G96 is a 64-bit octa-core CPU comprising two Arm Cortex-A76 cores running at 2.05GHz and six Arm Cortex-A55 cores running at 2.0GHz. It also has MediaTek HyperEngine 2.0 Lite gaming technology, as well as dual-band Wi-Fi, Bluetooth 5.2, and GPS connection.
-
Which is better Dimensity 800 or 700?
The 700 has lower-clocked CPU cores (-200 MHz) and a slower GPU than the equivalent Dimensity 800U. (one less core). A 2 core ARM Mali-G57 MC2 GPU, a Wi-Fi 5 modem, an LPDDR4x-2133 memory controller, an AI processing unit (APU 3.0), and video decoding and encoding are all included in the chip.
Also Read:
