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Home > Smartphone processors comparison > Dimensity 8200 vs Kirin 970 – specs and benchmarks

Dimensity 8200 Vs Kirin 970

Dimensity 8200
VS
Kirin 970
Dimensity 8200
Kirin 970
We have created a comprehensive comparison of the recently released Dimensity 8200 vs Kirin 970 SoCs by Mediatek and Hisilicon respectively. We've now weighed the advantages and disadvantages of these 8-core CPUs on the basis of their Geekbench, Antutu and 3DMark benchmarks with their technical specifications.
  1. Review
  2. Differences
  3. Benchmarks
  4. AnTuTu v9
  5. GeekBench 5
  6. Specs

Review

CPU Performance
Single and multi-core processor tests
Dimensity 8200
73
Kirin 970
26
Gaming Performance
GPU performance in games and OpenCL/Vulcan
Dimensity 8200
66
Kirin 970
44
Battery life
Efficiency of battery consumption
Dimensity 8200
86
Kirin 970
64
Tenzys Tech Score
Overall chip score
Dimensity 8200
75
Kirin 970
45

Key Differences

Pros of Mediatek Dimensity 8200
  • Dimensity 8200 has 31.36% higher CPU clock speed than Kirin 970 (3100 vs 2360 MHz).
  • Dimensity 8200 has 242.98% higher memory frequency than Kirin 970 (6400 vs 1866 MHz).
  • Dimensity 8200 has 60% smaller sized transistor than Kirin 970 (4 vs 10 nm).
  • Dimensity 8200 has 189.30% better AnTuTu 9 score than Kirin 970 (851 K vs 294 K).
  • Dimensity 8200 Support 71.81% higher memory bandwidth then Kirin 970 (51.2 vs 29.8 MHz).

Benchmarks

Performance tests in popular benchmarks
SoC:
Dimensity 8200
vs
Kirin 970

AnTuTu 9

Dimensity 8200 +187%
850501
Kirin 970
293981
CPU 210639 77046
GPU 339646 90560
Memory 139322 66398
UX 160894 59977
Total score 850501 293981

GeekBench 5

Single-Core Score
Dimensity 8200 +170%
1054
Kirin 970
390
Multi-Core Score
Dimensity 8200 +195%
4010
Kirin 970
1361
Image compression - 76.9 Mpixels/s
Face detection - 14 images/s
Speech recognition - 24.5 words/s
Machine learning - 21.8 images/s
Camera shooting - 11.4 images/s
HTML 5 - 1.46 Mnodes/s
SQLite - 417.7 Mnodes/s

3DMark

0%
Dimensity 8200
8%
Kirin 970
Score: 1050

Stability - 80%
Graphics test - 6 FPS
Score - 1050

Specifications

Full list of technical specifications of Mediatek Dimensity 8200 and Hisilicon Kirin 970

Display

Max On-Device Display 120Hz WQHD+ / 180Hz Full HD+ display support 4K @ 60 Hz
Max On-Display Resolution 2960 x 1440 3840 x 2160
Max External Display - -
HDR HDR10+ Adaptive support HDR, HDR-10
Color Depth - -
Color Gamut - -

  CPU

90%
Dimensity 8200
68%
Kirin 970
Frequency

Architecture 1x 3.1 GHz – Cortex A78
3x 3 GHz – Cortex A78
4x 2 GHz – Cortex A55
4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53
Cores 8 8
Base Frequency 2000 MHz 1840 MHz
Turbo Frequency 3100 MHz 2360 MHz
Instruction set - ARMv8-A
L1 cache - -
L2 cache - 0.5 MB
L3 cache 4 MB 2 MB
Process 4 10
Transistor count - 5.5 Billion
TDP - 9 W

Graphics

GPU name Mali-G610 MC6 Mali G72 MP12
Architecture Valhall 2 Bifrost
GPU frequency - 850 MHz
Execution units 6 12
Shading units - 192
FLOPS - 347 Gigaflops
Vulkan version 1.2 1.0
OpenCL version 2.0 2.0
DirectX version 12 12

Memory

Memory type LPDDR5 LPDDR4X
Memory frequency 6400 MHz 1866 MHz
Bus 4x 16 Bit 4x 16 Bit
Max bandwidth 51.2 Gbit/s 29.8 Gbit/s
Max size - 8 GB

Multimedia (ISP)

Neural processor (NPU) MediaTek APU 580(Multi-Core) Dedicated NPU
Storage type UFS 3.1 UFS 2.1
Max display resolution 2960 x 1440 3840 x 2160
Max camera resolution 1x 320MP 1x 48MP, 2x 20MP
Video capture 4K at 60FPS 4K at 30FPS
Video playback 4K at 60FPS 4K at 60FPS
Video codecs H.264, H.265, AV1, VP9 H.264, H.265, VP8, VP9, VC-1
Audio codecs AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC 32 [email protected] kHz, HD-audio

Connectivity

Download Speed
4G (MB/s)
Dimensity 8200
N/A
Kirin 970
1200
5G (MB/s)
Dimensity 8200
N/A
Kirin 970
N/A
Upload Speed
4G (MB/s)
Dimensity 8200
N/A
Kirin 970
150
5G (MB/s)
Dimensity 8200
2500
Kirin 970
N/A
Modem - -
4G support LTE Cat. 21 LTE Cat. 18
5G support Yes No
Peak Download speed Up to 4700 Mbps -
Peak Upload speed Up to 2500 Mbps -
Wi-Fi 6E 5
Bluetooth 5.3 4.2
Navigation GPS, GLONASS, Beidou, Galileo, QZSS GPS, GLONASS, Beidou, Galileo

Info

Announced Date December 2022 September 2017
Class Mid range Flagship
Model number - Hi3670
Official page Dimensity 8200 official site Kirin 970 official site
Mediatek Dimensity 8200
Mediatek Dimensity 8200
CPU
65%
GPU
66%
Memory
75%
Energy efficiency and battery life
86%

75


Review By TenzysTech
Hisilicon Kirin 970
Hisilicon Kirin 970
CPU
26%
GPU
44%
Memory
22%
Energy efficiency and battery life
64%

33.5


Review By TenzysTech

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