Snapdragon 860 Vs Kirin 970
We have created a comprehensive comparison of the recently released Snapdragon 860 vs Kirin 970 SoCs by Qualcomm and Hisilicon respectively. We've now weighed the advantages and disadvantages of these 8-core CPUs on the basis of their Geekbench, Antutu and 3DMark benchmarks with their technical specifications.
Review
CPU Performance
Single and multi-core processor tests
Gaming Performance
GPU performance in games and OpenCL/Vulcan
Battery life
Efficiency of battery consumption
Tenzys Tech Score
Overall chip score
Key Differences
Pros of Qualcomm Snapdragon 860
- Snapdragon 860 has 25.42% higher CPU clock speed than Kirin 970 (2960 vs 2360 MHz).
- Snapdragon 860 has 14.31% higher memory frequency than Kirin 970 (2133 vs 1866 MHz).
- Snapdragon 860 has 30% smaller sized transistor than Kirin 970 (7 vs 10 nm).
- Snapdragon 860 has 57.82% better AnTuTu 9 score than Kirin 970 (464 K vs 294 K).
- Snapdragon 860 has latest instruction set, hence better than Kirin 970.
- Snapdragon 860 Support 14.53% higher memory bandwidth than Kirin 970 (34.13 vs 29.8 MHz).
- Snapdragon 860 Support 66.67% higher memory bandwidth than Kirin 970 (2000 vs 1200 MHz).
Pros of Hisilicon Kirin 970
- Kirin 970 has 25.93% higher GPU clock speed than Snapdragon 860 (850 vs 675 MHz).
Benchmarks
Performance tests in popular benchmarksAnTuTu 9
| CPU | 143028 | 77046 |
| GPU | 179320 | 90560 |
| Memory | 69420 | 66398 |
| UX | 72190 | 59977 |
| Total score | 463958 | 293981 |
GeekBench 5
Single-Core Score
Multi-Core Score
| Image compression | 142.85 Mpixels/s | 76.9 Mpixels/s |
| Face detection | 20.3 images/s | 14 images/s |
| Speech recognition | 44.55 words/s | 24.5 words/s |
| Machine learning | 46.35 images/s | 21.8 images/s |
| Camera shooting | 22.85 images/s | 11.4 images/s |
| HTML 5 | 1.65 Mnodes/s | 1.46 Mnodes/s |
| SQLite | 777.9 Mnodes/s | 417.7 Mnodes/s |
3DMark
27%
SD 8608%
Kirin 970Score: 3455
| Stability | 98% | 80% |
| Graphics test | 20 FPS | 6 FPS |
| Score | 3455 | 1050 |
Specifications
Full list of technical specifications of Qualcomm Snapdragon 860 and Hisilicon Kirin 970Display
| Max On-Device Display | FHD+ @ 120 Hz | 4K @ 60 Hz |
| Max On-Display Resolution | QHD @ 60Hz | 3840 x 2160 |
| Max External Display | - | - |
| HDR | HDR10+ | HDR, HDR-10 |
| Color Depth | Up to 10-bit | - |
| Color Gamut | Rec2020 | - |
CPU
78%
SD 86062%
Kirin 970
Processor Speed (Frequency)
| Architecture |
1x 2.96 GHz – Cortex-A76 (Kryo 485 Gold) 3x 2.42 GHz – Cortex-A76 (Kryo 485 Gold) 4x 1.8 GHz – Cortex-A55 (Kryo 485 Silver) |
4x 2.36 GHz – Cortex A73 4x 1.84 GHz – Cortex A53 |
| Cores | 8 | 8 |
| Base Frequency | 1800 MHz | 1840 MHz |
| Turbo Frequency | 2960 MHz | 2360 MHz |
| Instruction set | ARMv8.1-A | ARMv8-A |
| L1 cache | - | - |
| L2 cache | - | 0.5 MB |
| L3 cache | 2 MB | 2 MB |
| Process | 7 nm | 10 nm |
| Transistor count | - | 5.5 Billion |
| TDP | 10 W | 9 W |
Graphics
| GPU name | Adreno 640 | Mali G72 MP12 |
| Architecture | Adreno 600 | Bifrost |
| GPU frequency | 675 MHz | 850 MHz |
| Execution units | 2 | 12 |
| Shading units | 384 | 192 |
| FLOPS | 1037 Gigaflops | 347 Gigaflops |
| Vulkan version | 1.1 | 1.0 |
| OpenCL version | 2.0 | 2.0 |
| DirectX version | 12 | 12 |
Memory
| Memory type | LPDDR4X | LPDDR4X |
| Memory frequency | 2133 MHz | 1866 MHz |
| Bus | 4 x 16 Bit | 4x 16 Bit |
| Max bandwidth | 34.13 Gbit/s | 29.8 Gbit/s |
| Max size | 16 GB | 8 GB |
Multimedia (ISP)
| Neural processor (NPU) | Hexagon 690 | Dedicated NPU |
| Storage type | EMMC 5.1, UFS 2.0, UFS 2.1, UFS 3.0, UFS 3.1 | UFS 2.1 |
| Max display resolution | 3840 x 2160 | 3840 x 2160 |
| Max camera resolution | 1x 192MP, 2x 22MP | 1x 48MP, 2x 20MP |
| Video capture | 4K at 120FPS | 4K at 30FPS |
| Video playback | 8K at 30FPS, 4K at 120FPS | 4K at 60FPS |
| Video codecs | H.264, H.265, VP8, VP9 | H.264, H.265, VP8, VP9, VC-1 |
| Audio codecs | AIFF, CAF, MP3, MP4, WAV | 32 bit@384 kHz, HD-audio |
Connectivity
Download Speed
4G (MB/s)
5G (MB/s)
Upload Speed
4G (MB/s)
5G (MB/s)
| Modem | X24 LTE, X50 5G | - |
| 4G support | LTE Cat. 20 | LTE Cat. 18 |
| 5G support | Yes | No |
| Peak Download speed | Up to 5000 Mbps | - |
| Peak Upload speed | Up to 1200 Mbps | - |
| Wi-Fi | 6 | 5 |
| Bluetooth | 5.0 | 4.2 |
| Navigation | GPS, GLONASS, Beidou, Galileo, QZSS, SBAS | GPS, GLONASS, Beidou, Galileo |
Info
| Announced Date | April 2019 | September 2017 |
| Class | Flagship | Flagship |
| Model number | SM8150-AC | Hi3670 |
| Official page | Snapdragon 860 official site | Kirin 970 official site |
Qualcomm Snapdragon 860
38.25
Review By TenzysTech
Hisilicon Kirin 970
22.75
Review By TenzysTech
