Overview - Snapdragon 870 Vs Dimensity 1000 Plus

We have created a comprehensive comparison of the recently released Snapdragon 870 vs Dimensity 1000 Plus SoCs by Qualcomm and Mediatek respectively. We've now weighed the advantages and disadvantages of these 8-core CPUs on the basis of their Geekbench, Antutu and 3DMark benchmarks with their technical specifications.

Features

Review

CPU Performance
Single and multi-core processor tests
Snapdragon 870 39
Dimensity 1000 Plus 31
Gaming Performance
GPU performance in games and OpenCL/Vulcan
Snapdragon 870 34
Dimensity 1000 Plus 26
Battery Life
Efficiency of battery consumption
Snapdragon 870 75
Dimensity 1000 Plus 75
Tenzys Tech Score
Overall chip score
Snapdragon 870 49
Dimensity 1000 Plus 44
Benchmarks

AnTuTu 9

Snapdragon 870 Dimensity 1000 Plus
CPU 179347 157984
GPU 270188 197648
Memory 98761 78051
UX 95818 87037
Total score 644114 520720
Key Differences

Pros of Qualcomm Snapdragon 870

  • Snapdragon 870 has 23.08% higher CPU clock speed than Dimensity 1000 Plus (3200 vs 2600 MHz).
  • Snapdragon 870 has 47.37% higher memory frequency than Dimensity 1000 Plus (2750 vs 1866 MHz).
  • Snapdragon 870 has 23.70% better AnTuTu 9 score than Dimensity 1000 Plus (644 K vs 521 K).
  • Snapdragon 870 Support 47.30% higher memory bandwidth than Dimensity 1000 Plus (44 vs 29.87 MHz).

Pros of Mediatek Dimensity 1000 Plus

  • Dimensity 1000 Plus has 31.78% higher GPU clock speed than Snapdragon 870 (850 vs 645 MHz).
  • Dimensity 1000 Plus has latest instruction set, hence better than Snapdragon 870.
Benchmarks

GeekBench 5

Single-Core Score

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Snapdragon 870 1038
Dimensity 1000 Plus 766

Multi-Core Score

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Snapdragon 870 3569
Dimensity 1000 Plus 2852

Image compression

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Snapdragon 870 180.6
Dimensity 1000 Plus 166.4

Face detection

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Snapdragon 870 25.25
Dimensity 1000 Plus 28.2

Speech recognition

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Snapdragon 870 54.7
Dimensity 1000 Plus 45.2

Machine learning

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Snapdragon 870 56.95
Dimensity 1000 Plus 46.9

Camera shooting

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Snapdragon 870 28
Dimensity 1000 Plus 27.8

HTML 5

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Snapdragon 870
Dimensity 1000 Plus 3.53

SQLite

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Snapdragon 870 989.1
Dimensity 1000 Plus 883.8

3DMark

Stability 90%

Graphics test 25 FPS
Stability 98%

Graphics test 22 FPS
Full list of technical specifications

Display

  • Max On-Device Display 4K @ 60 Hz, QHD+ @ 144 Hz Full HD+ @ 144 Hz
  • Max On-Display Resolution 3840 x 2160 2520 x 1080
  • Max External Display 4K @ 60 Hz -
  • HDR HDR10+, HDR10 HDR10+
  • Color Depth Up to 10-bit -
  • Color Gamut Rec2020 -
Full list of technical specifications

CPU

85%
Turbo Clock Speed

3200 MHz

69%
Turbo Clock Speed

2600 MHz

82%
Base Frequency

1800 MHz

91%
Base Frequency

2000 MHz

  • Architecture 1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
    3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
    4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
    4x 2.6 GHz – Cortex-A77
    4x 2 GHz – Cortex-A55
  • Cores 8 8
  • Instruction set ARMv8.2-A ARMv8.3-A
  • L1 cache 512 KB -
  • L2 cache 1 MB -
  • L3 cache 4 MB 0.512 MB
  • Process 7 nm 7 nm
  • Transistor count - -
  • TDP 10 W 10 W
Full list of technical specifications

Graphics

  • GPU name Adreno 650 Mali-G77 MC9
  • Architecture Adreno 600 Valhall
  • GPU frequency 645 MHz 850 MHz
  • Execution units 2 9
  • Shading units 512 144
  • FLOPS 1,267 Gigaflops 800 Gigaflops
  • Vulkan version 1.1 1.1
  • OpenCL version 2.0 2.0
  • DirectX version 12 12
Full list of technical specifications

Memory

  • Memory frequency 2750 MHz 1866 MHz
  • Max bandwidth 44 Gbit/s 29.87 Gbit/s
  • Max Size 16 GB 16 GB
  • Memory type LPDDR5 LPDDR4X
  • Bus 4x 16 Bit 4x 16 Bit
Full list of technical specifications

Multimedia (ISP)

  • Neural processor (NPU) Hexagon 698 MediaTek APU 3.0
  • Storage type UFS 3.0, UFS 3.1 UFS 2.2
  • Max display resolution 3840 x 2160 2520 x 1080
  • Max camera resolution 1x 200MP, 2x 25MP 1x 80MP, 2x 32MP
  • Video capture 8K at 30FPS, 4K at 60FPS 4K at 30FPS
  • Video playback 8K at 30FPS 4K at 30FPS
  • Video codecs H.264, H.265, VP8, VP9 H.264, H.265, AV1, VP9
  • Audio codecs AAC, AIFF, CAF, MP3, MP4, WAV AIFF, CAF, MP3, MP4, WAV
Full list of technical specifications

Connectivity

  • Modem X55 -
  • 4G support LTE Cat. 24 LTE Cat. 18
  • 5G support Yes Yes
  • Wi-Fi 6 6
  • Bluetooth 5.2 5.1
  • Navigation GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC GPS, GLONASS, Beidou, Galileo, QZSS
Full list of technical specifications

Info

Review

Review By TenzysTech

Qualcomm Snapdragon 870

CPU
39%
GPU
34%
Memory
32%
Energy efficiency and battery life
75%

Mediatek Dimensity 1000 Plus

CPU
31%
GPU
26%
Memory
22%
Energy efficiency and battery life
75%
Choose between two processors

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